International Journal of Manufacturing Technology and Management, Volume 9

Volume 9, Number 1/2, 2006

• Mark J. Jackson:
  Micro-grinding electronic and optical materials using diamond-coated piezoelectric materials. 1-17
  
• Nobuyuki Moronuki, Yasunori Saito, Arata Kaneko:
  Vibration micro-machining of low-melting temperature glass. 18-33
  
• Noritaka Kawasegi, Noboru Morita, Shigeru Yamada, Noboru Takano, Tatsuo Oyama, Kiwamu Ashida, Jun Taniguchi, Iwao Miyamoto, Sadao Momota:
  Etching characteristics of a silicon surface induced by focused ion beam irradiation. 34-50
  
• Nobuhito Yoshihara, Tsunemoto Kuriyagawa, Hiromichi Ono, Katsuo Syoji:
  Nano-topography on axisymmetric aspherical ground surfaces. 51-63
  
• Kiyoshi Suzuki, Yoshiaki Shishido, Nobuhiro Koga, Takeki Shirai, Manabu Iwai, Tetsutaro Uematsu:
  Development of a crack cutting method for glass plates used for flat panel displays. 64-78
  
• Katsutoshi Tanaka, Masahiko Fukuta, Kiyoshi Suzuki, Manabu Iwai, Tetsutaro Uematsu, Syoji Mishiro:
  Improvement of grinding performance in ultra-precision grinding of lens mould by the help of megasonic coolant. 79-93
  
• Kiyoshi Suzuki, Manabu Iwai, Anurag Sharma, Sadao Sano, Tetsutaro Uematsu:
  Low-wear diamond electrode for micro-EDM of die-steel. 94-108
  
• Tsuyoshi Kaku, Tsunemoto Kuriyagawa, Nobuhito Yoshihara:
  Electrorheological fluid-assisted polishing of WC micro aspherical glass moulding dies. 109-119
  
• Jun Shimizu, Libo Zhou, Hiroshi Eda:
  Molecular dynamics simulation of vibration-assisted cutting: influences of vibration parameters. 120-129
  
• Libo Zhou, Zhongjun Qiu, Tomohiko Ishikawa, Tatsuo Kawakami, Hiroshi Eda:
  Development of vision controlled bio-cell manipulation system. 130-143
  
• Arvind Chandrasekaran, Muthukumaran Packirisamy, Ion Stiharu, Andre Delage:
  Hybrid bulk micro-machining process suitable for roughness reduction in optical MEMS devices. 144-159
  
• Yongbo Wu, Masana Kato:
  Geometrical arrangement of ID grinding wheel in simultaneous-ID/OD combination centreless grinding. 160-171
  
• Nobuo Yasunaga, Yukiharu Yamamoto:
  High temperature MCP process suitable for extremely hard high functional SiC wafers. 172-182
  
• Xijun Kang, Jun'ichi Tamaki, Akihiko Kubo:
  Effect of cutting edge truncation on ductile-regime grinding of hard and brittle materials. 183-200
  

Volume 9, Number 3/4, 2006

• Toshimichi Moriwaki, Keiichi Shirase:
  Intelligent machine tools: current status and evolutional architecture. 204-218
  
• Zezhong C. Chen, Zhibin Miao:
  An intelligent approach to non-constant feed rate determination for high-performance 2D CNC milling. 219-236
  
• Dusan N. Sormaz, Deepak V. Pisipati, Prashant A. Borse:
  Virtual manufacturing of milling operations with multiple tool paths. 237-264
  
• Pingjun Xia, Yingxue Yao, Jiangsheng Liu, Jianguang Li:
  Optimising assembly planning based on virtual reality and bionic algorithm. 265-293
  
• Da-Yin Liao, Min-Yi Tsai:
  A quota-constrained, speed control model for production scheduling in semiconductor manufacturing. 294-308
  
• Qi Hao, Weiming Shen, Lihui Wang:
  Collaborative manufacturing resource scheduling using Agent-based Web Services. 309-327
  
• Matthew Chiu, Hao Wen Lin, Sev V. Nagalingam, Grier C. I. Lin:
  Inter-operability framework towards virtual integration of SMEs in the manufacturing industry. 328-349
  
• V. Dhanalakshmi, K. Sankaranarayanasamy, Subramaniam Arunachalam, S. C. Lenny Koh:
  Extraction of simple and concatenated features from a wire frame model using IGES data. 350-371
  
• Gerald Weigert, Sebastian Werner, Sven Horn:
  Simulation aided optimisation of manufacturing processes in university education. 372-386