Volume 23,
Number 1,
January-February 2006
EIC Message
Features
- Bernhard Peischl, Franz Wotawa:
Automated Source-Level Error Localization in Hardware Designs.
8-19
Electronic Edition (link) BibTeX
- Hamilton Klimach, Carlos Galup-Montoro, Márcio C. Schneider, Alfredo Arnaud:
MOSFET Mismatch Modeling: A New Approach.
20-29
Electronic Edition (link) BibTeX
- Kevin Lucas, Chi-Min Yuan, Robert Boone, Karl Wimmer, Kirk Strozewski, Olivier Toublan:
Logic Design for Printability Using OPC Methods.
30-37
Electronic Edition (link) BibTeX
- Julio Pérez Acle, Matteo Sonza Reorda, Massimo Violante:
Early, Accurate Dependability Analysis of CAN-Based Networked Systems.
38-45
Electronic Edition (link) BibTeX
- David C. Keezer, Dany Minier, Patrice Ducharme:
Source-Synchronous Testing of Multilane PCI Express and HyperTransport Buses.
46-57
Electronic Edition (link) BibTeX
- Antonio Petraglia, Jorge M. Cañive, Mariane R. Petraglia:
Efficient Parametric Fault Detection in Switched-Capacitor Filters.
58-66
Electronic Edition (link) BibTeX
Book Reviews
Departments
The Last Byte
Volume 23,
Number 2,
March-April 2006
EIC Message
Features
- Phil Nigh:
Guest Editor's Introduction: Evolving Methods for Detecting and Handling Reliability Defects.
86-87
Electronic Edition (link) BibTeX
- Mohd Fairuz Zakaria, Zainal Abu Kassim, Melanie Po-Leen Ooi, Serge N. Demidenko:
Reducing Burn-in Time through High-Voltage Stress Test and Weibull Statistical Analysis.
88-98
Electronic Edition (link) BibTeX
- Ritesh P. Turakhia, W. Robert Daasch, Joel Lurkins, Brady Benware:
Changing Test and Data Modeling Requirements for Screening Latent Defects as Statistical Outliers.
100-109
Electronic Edition (link) BibTeX
- Thomas S. Barnett, Matt Grady, Kathleen G. Purdy, Adit D. Singh:
Combining Negative Binomial and Weibull Distributions for Yield and Reliability Prediction.
110-116
Electronic Edition (link) BibTeX
- John M. Carulli Jr., Thomas J. Anderson:
The Impact of Multiple Failure Modes on Estimating Product Field Reliability.
118-126
Electronic Edition (link) BibTeX
Special Features
Book Reviews
Departments
The Last Byte
Volume 23,
Number 3,
May-June 2006
From the EIC
DAC Watch
Conference Reports
System-in-Package Design and Test
- Bruce C. Kim, Yervant Zorian:
Guest Editors' Introduction: Big Innovations in Small Packages.
186-187
Electronic Edition (link) BibTeX
- Peter Rickert, William Krenik:
Cell Phone Integration: SiP, SoC, and PoP.
188-195
Electronic Edition (link) BibTeX
- Thomas Brandtner:
Chip-Package Codesign Flow for Mixed-Signal SiP Designs.
196-202
Electronic Edition (link) BibTeX
- Davide Appello, Paolo Bernardi, Michelangelo Grosso, Matteo Sonza Reorda:
System-in-Package Testing: Problems and Solutions.
203-211
Electronic Edition (link) BibTeX
- Dong Gun Kam, Joungho Kim, Jiheon Yu, Ho Choi, Kicheol Bae, Choonheung Lee:
Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array.
212-219
Electronic Edition (link) BibTeX
- Vijay K. Madisetti:
Electronic System, Platform, and Package Codesign.
220-233
Electronic Edition (link) BibTeX
- Vincent Kerzerho, Philippe Cauvet, Serge Bernard, Florence Azaïs, Mariane Comte, Michel Renovell:
A Novel DFT Technique for Testing Complete Sets of ADCs and DACs in Complex SiPs.
234-243
Electronic Edition (link) BibTeX
Book Reviews
Departments
The Last Byte
Volume 23,
Number 4,
July-August 2006
From the EIC
Conference Reports
On-Chip Testing
Departments
The Last Byte
Volume 23,
Number 5,
September-October 2006
From the EIC
Electronic System-Level Design
Counterpoint
ITC Special Section
- Kenneth M. Butler:
Guest Editor's Introduction: ITC Helps Get More Out of Test.
388-389
Electronic Edition (link) BibTeX
- Jeffrey E. Nelson, Thomas Zanon, Jason G. Brown, Osei Poku, R. D. (Shawn) Blanton, Wojciech Maly, Brady Benware, Chris Schuermyer:
Extracting Defect Density and Size Distributions from Product ICs.
390-400
Electronic Edition (link) BibTeX
- Nisar Ahmed, Mohammad Tehranipoor:
Improving Transition Delay Test Using a Hybrid Method.
402-412
Electronic Edition (link) BibTeX
- Sebastià A. Bota, José Luis Rosselló, Carol de Benito, Ali Keshavarzi, Jaume Segura:
Impact of Thermal Gradients on Clock Skew and Testing.
414-424
Electronic Edition (link) BibTeX
Departments
The Last Byte
Volume 23, Number 6, November/December 2006
- Tim Cheng:
Handling variations and uncertainties.
434
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.148
- T. M. Mak,
Sani R. Nassif:
Guest Editors' Introduction: Process Variation and Stochastic Design and Test.
436-437
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.147
- Mehrdad Nourani,
Arun Radhakrishnan:
Testing On-Die Process Variation in Nanometer VLSI.
438-451
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.157
- Sounil Biswas,
Ronald D. Blanton:
Statistical Test Compaction Using Binary Decision Trees.
452-462
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.154
- Soumendu Bhattacharya,
Abhijit Chatterjee:
A DFT Approach for Testing Embedded Systems Using DC Sensors.
464-475
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.136
- Eric S. Fetzer:
Using Adaptive Circuits to Mitigate Process Variations in a Microprocessor Design.
476-483
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.159
- Dennis Sylvester,
David Blaauw,
Eric Karl:
ElastIC: An Adaptive Self-Healing Architecture for Unpredictable Silicon.
484-490
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.145
- Grant Martin:
Book Reviews: NoC, NoC ... Who's there?
500-501
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.153
- Fabian Vargas:
Design and test on chip for EMC.
502-503
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.143
- Vladimir Hahanov:
East-West Design & Test Workshop.
504-505
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.144
- Bruce C. Kim:
TTTC Newsletter.
507
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.158
- Shekhar Borkar:
Tackling variability and reliability challenges.
520
http://doi.ieeecomputersociety.org/10.1109/MDT.2006.156
Copyright © Wed Jun 4 19:08:44 2008
by Michael Ley (ley@uni-trier.de)
