Katsuhito Yoshida
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2004
1
EE
Katsuhito Yoshida,
Hideaki Morigami
: Thermal properties of diamond/copper composite material.
Microelectronics Reliability 44
(2): 303-308 (2004)
Coauthor Index
1
Hideaki Morigami
[
1
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Copyright ©
Tue Nov 3 08:52:44 2009 by
Michael Ley
(
ley@uni-trier.de
)
