| |
| * | 2007 | |
|---|---|---|
| 2 | EE | Xinyu Wu, Wingkwong Chung, Hang Tong, Jun Cheng, Yangsheng Xu: A New Solder Paste Inspection Device: Design and Algorithm. ICRA 2007: 680-685 |
| 2006 | ||
| 1 | EE | Zhancheng Wang, Weimin Li, Hang Tong, Yangsheng Xu: A Novel On-board Temperature Monitoring Approach in the Reflow Soldering Process. IROS 2006: 4245-4251 |
| 1 | Jun Cheng | [2] |
| 2 | Wingkwong Chung | [2] |
| 3 | Weimin Li | [1] |
| 4 | Zhancheng Wang | [1] |
| 5 | Xinyu Wu | [2] |
| 6 | Yangsheng Xu | [1] [2] |