| |
| * | 2006 | |
|---|---|---|
| 1 | EE | M. Ullán, M. Lozano, M. Chmeissani, G. Blanchot, Enric Cabruja, J. García, M. Maiorino, R. Martínez, G. Pellegrini, C. Puigdengoles: Test structure assembly for bump bond yield measurement on high density flip chip technologies. Microelectronics Reliability 46(7): 1095-1100 (2006) |
| 1 | G. Blanchot | [1] |
| 2 | Enric Cabruja | [1] |
| 3 | M. Chmeissani | [1] |
| 4 | J. García | [1] |
| 5 | M. Lozano | [1] |
| 6 | R. Martínez | [1] |
| 7 | G. Pellegrini | [1] |
| 8 | C. Puigdengoles | [1] |
| 9 | M. Ullán | [1] |