| |
| * | 2009 | |
|---|---|---|
| 4 | EE | Jason Cong, Guojie Luo: A multilevel analytical placement for 3D ICs. ASP-DAC 2009: 361-366 |
| 2008 | ||
| 3 | EE | Jason Cong, Guojie Luo: Highly efficient gradient computation for density-constrained analytical placement methods. ISPD 2008: 39-46 |
| 2 | EE | Jason Cong, Guojie Luo, E. Radke: Highly Efficient Gradient Computation for Density-Constrained Analytical Placement. IEEE Trans. on CAD of Integrated Circuits and Systems 27(12): 2133-2144 (2008) |
| 2007 | ||
| 1 | EE | Jason Cong, Guojie Luo, Jie Wei, Yan Zhang: Thermal-Aware 3D IC Placement Via Transformation. ASP-DAC 2007: 780-785 |
| 1 | Jason Cong | [1] [2] [3] [4] |
| 2 | E. Radke | [2] |
| 3 | Jie Wei | [1] |
| 4 | Yan Zhang | [1] |