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*2004
1EEJong-heon Kim, In-Soo Kang, Chi-jung Song, Young-Jik Hur, Hak-Nam Kim, Esdy Baek, Tae-Jun Seo: Flip-chip packaging solution for CMOS image sensor device. Microelectronics Reliability 44(1): 155-161 (2004)

Coauthor Index

1Young-Jik Hur [1]
2In-Soo Kang [1]
3Hak-Nam Kim [1]
4Jong-heon Kim [1]
5Tae-Jun Seo [1]
6Chi-jung Song [1]

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