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Kazuhiro Baba Vis

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*2005
2EETadanori Shimoto, Kazuhiro Baba, Koji Matsui, Jun Tsukano, Takehiko Maeda, Kenji Oyachi: Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs. Microelectronics Reliability 45(3-4): 567-574 (2005)
2004
1EETadanori Shimoto, Katsumi Kikuchi, Kazuhiro Baba, Koji Matsui, Hirokazu Honda, Keiichiro Kata: High-performance FCBGA based on multi-layer thin-substrate packaging technology. Microelectronics Reliability 44(3): 515-520 (2004)

Coauthor Index

1Hirokazu Honda [1]
2Keiichiro Kata [1]
3Katsumi Kikuchi [1]
4Takehiko Maeda [2]
5Koji Matsui [1] [2]
6Kenji Oyachi [2]
7Tadanori Shimoto [1] [2]
8Jun Tsukano [2]

Copyright © Tue Nov 3 08:52:44 2009 by Michael Ley (ley@uni-trier.de)