ITC 2002:
Baltimore,
MD,
USA
Proceedings IEEE International Test Conference 2002, Baltimore, MD, USA, October 7-10, 2002.
IEEE Computer Society 2002
Homegrown versus Commercial Solutions for Low-Cost Text
- Bozena Kaminska:
Homegrown Tools and Equipment versus EDA and ATE Vendors: The Future of Design to Test Product Lines.
23
- Bill Bottoms:
Homegrown Tools and Equipment versus EDA and ATE Vendors: The Future of Design to Test Product Lines.
24
- Greg Spirakis:
Homegrown Tools and Equipment versus EDA and ATE Vendors: The Future of Design to Test Product Lines.
25
- Dale E. Hoffman:
Homegrown Tools and Equipment versus EDA and ATE Vendors: The Future of Design to Test Product Lines.
26
Testing the Tester
Plenary
- Alex d'Arbeloff:
Managing in the ATE Business - Postcards from the Past, Lessons for the Future.
12
- Peter C. Maxwell:
The Heisenberg Uncertainty of Test.
13
Memory Testing
Advances in Soc Testing
- Bart Vermeulen, Tom Waayers, Sjaak Bakker:
EEE 1149.1-Compliant Access Architecture for Multiple Core Debug on Digital System Chips.
55-63
- Paul Theo Gonciari, Bashir M. Al-Hashimi, Nicola Nicolici:
Integrated Test Data Decompression and Core Wrapper Design for Low-Cost System-on-a-Chip Testing.
64-73
- Yu Huang, Sudhakar M. Reddy, Wu-Tung Cheng, Paul Reuter, Nilanjan Mukherjee, Chien-Chung Tsai, Omer Samman, Yahya Zaidan:
Optimal Core Wrapper Width Selection and SOC Test Scheduling Based on 3-D Bin Packing Algorithm.
74-82
Defect-Oriented Test
High-Performance Timing Measurements
Test Data Reduction
Memory DFT,
Bist and Repair
- O. Hirabayashi, A. Suzuki, T. Yabe, A. Kawasumi, Y. Takeyama, K. Kushida, A. Tohata, N. Otsuka:
DFT Techniques for Wafer-Level At-Speed Testing of High-Speed SRAMs.
164-169
- Shigeki Tomishima, Hiroaki Tanizaki, Mitsutaka Niiro, Masanao Maruta, Hideto Hidaka, T. Tada, Kenji Gamo:
A Variable Drivability (VD) Output Buffer for the System In a Package (SIP) and High Frequency Wafer Test.
170-177
- Bruce Cowan, Owen Farnsworth, Peter Jakobsen, Steven F. Oakland, Michael Ouellette, Donald L. Wheater:
On-Chip Repair and an ATE Independent Fusing Methodology.
178-186
- Jayasanker Jayabalan, Juraj Povazanec:
Integration of SRAM Redundancy into Production Test.
187-193
Design Validation - Novel ATPG Applications
- Jacob A. Abraham, Vivekananda M. Vedula, Daniel G. Saab:
Verifying Properties Using Sequential ATPG.
194-202
- Ganapathy Parthasarathy, Madhu K. Iyer, Tao Feng, Li-C. Wang, Kwang-Ting Cheng, Magdy S. Abadir:
Combining ATPG and Symbolic Simulation for Efficient Validation of Embedded Array Systems.
203-212
- Jayanta Bhadra, Narayanan Krishnamurthy:
Automatic Generation of Design Constraints in Verifying High Performance Embedded Dynamic Circuits.
213-222
- Andreas G. Veneris, Magdy S. Abadir, Mandana Amiri:
Design Rewiring Using ATPG.
223-232
Novel Techniques for Diagnostics
- Ronald D. Blanton, John T. Chen, Rao Desineni, Kumar N. Dwarakanath, Wojciech Maly, Thomas J. Vogels:
Fault Tuples in Diagnosis of Deep-Submicron Circuits.
233-241
- Yasuo Sato, Iwao Yamazaki, Hiroki Yamanaka, Toshio Ikeda, Masahiro Takakura:
A Persistent Diagnostic Technique for Unstable Defects.
242-249
- David B. Lavo, Ismed Hartanto, Tracy Larrabee:
Multiplets, Models, and the Search for Meaning: Improving Per-Test Fault Diagnosis.
250-259
- Camelia Hora, Rene Segers, Stefan Eichenberger, Maurice Lousberg:
An Effective Diagnosis Method to Support Yield Improvement.
260-269
Connecting Disconnects
Test Data Compression
- Janusz Rajski, Jerzy Tyszer, Mark Kassab, Nilanjan Mukherjee, Rob Thompson, Kun-Han Tsai, Andre Hertwig, Nagesh Tamarapalli, Grzegorz Mrugalski, Geir Eide, Jun Qian:
Embedded Deterministic Test for Low-Cost Manufacturing Test.
301-310
- Subhasish Mitra, Kee Sup Kim:
X-Compact: An Efficient Response Compaction Technique for Test Cost Reduction.
311-320
- C. V. Krishna, Nur A. Touba:
Reducing Test Dat Volume Using LFSR Reseeding with Seed Compression.
321-330
- Francis G. Wolff, Christos A. Papachristou:
Multiscan-Based Test Compression and Hardware Decompression Using LZ77.
331-339
Lecture Series - Embedded IP for Soc Infrastructure
Chip-Level Crosstalk Identification and Testing
Advances in Fault Simulation and Test Generation
- A. V. S. S. Prasad, Vishwani D. Agrawal, Madhusudan V. Atre:
A New Algorithm for Global Fault Collapsing into Equivalence and Dominance Sets.
391-397
- Li-C. Wang, Magdy S. Abadir, Juhong Zhu:
On Testing High-Performance Custom Circuits without Explicit Testing of the Internal Faults.
398-406
- Jing-Jia Liou, Li-C. Wang, Kwang-Ting Cheng, Jennifer Dworak, M. Ray Mercer, Rohit Kapur, Thomas W. Williams:
Analysis of Delay Test Effectiveness with a Multiple-Clock Scheme.
407-416
Adventures in Interfacing
DFT Testers
Production Test Automation
Soft and Hard Failure Analysis and On-Line Testing
Soc Benchmarks
Appliaction Series - High-Speed Test Interfaces
- Todd Sargent:
Physical Principles of Interface Design.
549-554
- Thomas P. Warwick:
What a Device Interface Board Really Costs: An Evaluation of Technical Considerations for Testing Products Operating in the Gigabit Region.
555-564
- David E. McFeely:
The Process and Challenges of a High-Speed DUT Board Project.
565-573
Test and Debug of Microprocessors
- B. Bailey, A. Metayer, B. Svrcek, Nandu Tendolkar, E. Wolf, Eric Fiene, Mike Alexander, Rick Woltenberg, Rajesh Raina:
Test Methodology for Motorola's High Performance e500 Core Based on PowerPC Instruction Set Architecture.
574-583
- Timothe Litt:
Support for Debugging in the Alpha 21364 Microprocessor.
584-589
- Praveen Parvathala, Kaila Maneparambil, William Lindsay:
FRITS - A Microprocessor Functional BIST Method.
590-598
FPGA Testing
Lecture Series-Silicon Debug
- Hari Balachandran, Kenneth M. Butler, Neil Simpson:
Facilitating Rapid First Silicon Debug.
628-637
- Bart Vermeulen, Tom Waayers, Sandeep Kumar Goel:
Core-Based Scan Architecture for Silicon Debug.
638-647
- Xinli Gu, Weili Wang, Kevin Li, Heon C. Kim, Sung Soo Chung:
Re-Using DFT Logic for Functional and Silicon Debugging Test.
648-656
- Don Douglas Josephson:
The Manic Depression of Microprocessor Debug.
657-663
- Carol Pyron, Rekha Bangalore, Dawit Belete, Jason Goertz, Ashutosh Razdan, Denise Younger:
Silicon Symptoms to Solutions: Applying Design for Debug Techniques.
664-672
Data Analysis and Yield Model Validation
- Robert Madge, B. H. Goh, V. Rajagopalan, C. Macchietto, W. Robert Daasch, Chris Schuermyer, C. Taylor, David Turner:
Screening MinVDD Outliers Using Feed-Forward Voltage Testing.
673-682
- Minh Quach, Tuan Pham, Tim Figal, Bob Kopitzke, Pete O'Neill:
Wafer-Level Defect-Based Testing Using Enhanced Voltage Stress and Statistical Test Data Evaluation.
683-692
- Thomas S. Barnett, Matt Grady, Kathleen G. Purdy, Adit D. Singh:
Redundancy Implications for Early-Life Reliability: Experimental Verification of an Integrated Yield-Reliability Model.
693-699
Jitter Testing in Multi-Gigahertz Digital Systems
Efficient Approaches to Soc Testing
1149.1 Verification and Validation
Scan Stitching
- David Berthelot, Samit Chaudhuri, Hamid Savoj:
An Efficient Linear Time Algorithm for Scan Chain Optimization and Repartitioning.
781-787
- Loïs Guiller, Frederic Neuveux, S. Duggirala, R. Chandramouli, Rohit Kapur:
Integrating DFT in the Physical Synthesis Flow.
788-795
- Yannick Bonhomme, Patrick Girard, Christian Landrault, Serge Pravossoudovitch:
Power Driven Chaining of Flip-Flops in Scan Architectures.
796-803
- Frank te Beest, Ad M. G. Peeters, Marc Verra, Kees van Berkel, Hans G. Kerkhoff:
Automatic Scan Insertion and Test Generation for Asynchronous Circuits.
804-813
DFT for Manufacturing Problems
Mixed-Signal Test Techniques
Go-Fast ATE!
System Test Design,
Bist and System Verification
Advances in IDDX
Delay-Test
Embedded Test for Analog and Digital
Maximizing Test Effectiveness and Minimizing Cost
Board Test and Bist for Mems
Debug and Diagnosis
Delay-Test:
Practical Experience and Solutions
- Dawit Belete, Ashutosh Razdan, William Schwarz, Rajesh Raina, Christopher Hawkins, Jeff Morehead:
Use of DFT Techniques In Speed Grading a 1GHz+ Microprocessor .
1111-1119
- Jayashree Saxena, Kenneth M. Butler, John Gatt, R. Raghuraman, Sudheendra Phani Kumar, Supatra Basu, David J. Campbell, John Berech:
Scan-Based Transition Fault Testing - Implementation and Low Cost Test Challenges .
1120-1129
- Bhaskar Chatterjee, Manoj Sachdev, Ali Keshavarzi:
A DFT Technique for Low Frequency Delay Fault Testing in High Performance Digital Circuits.
1130-1139
RF Testing
Test Resource
Can System Test and IC Test Learn from Each Other?
Taps All Over My Chips
Can Scan Achieve The Quality Level We Are Looking For?
- Anjali Kinra Vij:
Good Scan = Good Quality Level? Well, It Depends ?
1195
- Carol Pyron:
Scan and BIST Can Almost Achieve Test Quality Levels.
1196
- Grady Giles:
Is Scan (Alone) Sufficient to Test Today?s Microprocessors? Not Quite, but We Can?t Get the Job Done Without It.
1197
- Phil Nigh:
Scan-Based Testing: The Only Practical Solution for Testing ASIC/Consumer Products.
1198
- David M. Wu:
Trouble With Scan.
1199-1200
Mixed-Signal Bist:
Fact or Fiction?
Mission Possible?:
An Open Ate Tester Architecture
The Impacts of Outsourcing on Test
Test and Repair of Commodity and Embedded Flash Memories
- Jean Michel Daga:
Test and Repair of Embedded Flash Memories.
1219
- Paul Okino:
Test Time Impact of Redundancy Repair in Embedded Flash Memory.
1220
- Riichiro Shirota:
Test and Repair of Non-Volatile Commodity and Embedded Memories (NAND Flash Memory).
1221
- Roger Barth:
Selective Optimization of Test for Embedded Flash Memory.
1222
- Shigeo Tsuchida:
Test and Repair of Nonvolatile Commodity and Embedded Memories.
1223-1224
Testing Highly Integrated Circuits and Systems Using A Low-Cost Tester:
How to Overcome The Challenge?
- Mustapha Slamani:
Testing Highly Integrated Wireless Circuits and Systems with Low Cost Tester: How to Overcome the Challenge?
1225
- Alan Kafton:
Wireless SOC Testing: Can RF Testing Costs Be Reduced?
1226-1227
Multi-GHZ Era:
Test Challenges and Solutions
- C. Hawkins, J. Segura:
Testing Highly Integrated Wireless Circuits and Systems with Low Cost Tester: How to Overcome the Challenge?
1228
- Takahiro J. Yamaguchi:
Wireless SOC Testing: Can RF Testing Costs Be Reduced?
1229
- David C. Keezer:
GHz Testing and Its Fuzzy Targets.
1230
- Manoj Sachdev:
Multi-GHz Interface Devices Should Be Tested Using External Test Resources.
1231
- Mike Tripp:
Challenges and Solutions for Multi-Gigahertz Testing .
1232
- Ulrich Schoettmer:
Multi-Gigahertz Digital Test Challenges and Techniques.
1233-1234
Board Test and ITC:
What Does the Future Hold?
2001 ITC Best Paper
Copyright © Mon Nov 2 20:54:11 2009
by Michael Ley (ley@uni-trier.de)